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Showing results 1 to 3 of 3

Issue Date	Title Author(s) Journal	View
2008-02	Effects of a magnetic field on the copper metallization using the electroplating process Park, Byung Nam ; Shon, Yeong Soo ; Choi, Sie Young Microelectronic Engineering, v.85, no.2, pp.308 - 314, 2008-02	615
2008-02	Effects of a magnetic field on the copper metallization using the electroplating process Park, Byung Nam ; Shon, Yeong Soo ; Choi, Sie Young Microelectronic Engineering, v.85, no.2, pp.308 - 314, 2008-02	591
2014-07-01	The effects of nitrogen incorporation on the properties of atomic layer deposited Ru thin films as a direct-plateable diffusion barrier for Cu interconnect Mun, Ki-Yeung ; Hong, Tae Eun ; Cheon, Taehoon ; Jang, Yujin ; Lim, Byoung-Yong ; Kim, Sunjung ; Kim, Soo-Hyun Thin Solid Films, v.562, pp.118 - 125, 2014-07-01	498

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